ENGS 86 Independent Projects (AB Students)

Degree Program


Faculty Advisor

Dr. Ronald Lasky

Document Type


Publication Date

Spring 2019


This project compares past board assembly roadmaps with actual technological outcomes, examining the progression of predictions across seven significant aspects of board assembly covered in the 1994, 2002, 2007, 2013 and 2017 roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux and 7) Die Attach Adhesives. It should be noted that there are discrepancies between these roadmaps—from general outline to the many aspects of board assembly that are investigated. This project aims to bridge these discrepancies in a comprehensive fashion to better inform iNEMI and identify possible areas for improvement.

Included in

Engineering Commons