Dr. Ronald Lasky
This project compares past board assembly roadmaps with actual technological outcomes, examining the progression of predictions across seven significant aspects of board assembly covered in the 1994, 2002, 2007, 2013 and 2017 roadmaps: 1) Conversion Costs, 2) NPI Cycle Time, 3) Component Trends, 4) Solder Paste, 5) Bar Solder, 6) Wave Solder Flux and 7) Die Attach Adhesives. It should be noted that there are discrepancies between these roadmaps—from general outline to the many aspects of board assembly that are investigated. This project aims to bridge these discrepancies in a comprehensive fashion to better inform iNEMI and identify possible areas for improvement.
Balch, Annaka Rose, "Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes" (2019). ENGS 86 Independent Projects (AB Students). 5.